cic t ype (h=2.4mm) 1.0mm spacing (smt) p.c. board dimension applicable fpc dimension t 0.3 0.05 no. of pins a b c d no. of pins a b c d 04 3.0 5.1 9.7 4.5 17 16.0 18.1 22.7 17.5 05 4.0 6.1 10.7 5.5 18 17.0 19.1 23.7 18.5 06 5.0 7.1 11.7 6.5 19 18.0 20.1 24.7 19.5 07 6.0 8.1 12.7 7.5 20 19.0 21.1 25.7 20.5 08 7.0 9.1 13.7 8.5 21 20.0 22.1 26.7 21.5 09 8.0 10.1 14.7 9.5 22 21.0 23.1 27.7 22.5 10 9.0 11.1 15.7 10.5 24 23.0 25.1 29.7 24.5 11 10.0 12.1 16.7 11.5 26 25.0 27.1 31.7 26.5 12 11.0 13.1 17.7 12.5 28 27.0 29.1 33.7 28.5 13 12.0 14.1 18.7 13.5 14 13.0 15.1 19.7 14.5 15 14.0 16.1 20.7 15.5 29 28.0 30.1 34.7 29.5 16 15.0 17.1 21.7 16.5 30 29.0 31.1 35.7 30.5 upper contact type cfp24 -01 f no. of pins hold down packing style 01 with embossed taping 02 without embossed taping 11 with vinyl bag 12 without vinyl bag features 1. 1.0mm-pitch smt-ready fpc connector usable with cic (carbon in circuit) printing. 2. either upper or lower contact location available. 3. of the zif structure. 4. supplied in emboss-tape packaging for automatic mounting. 5. a lead-free product. specifications 1. rating : 0.5a, 100v ac/dc 2. contact resistance : 30m ? , max. 3. insulation resistance : 500m ? , min. at 500v dc 4. withstanding voltage : 500v ac for one minute 5. operating temperature range : ?5?c to +70?c material and plating housing : polyphenylene sulfide (pps), natural color, 94v-0 cover : polyphenylene sulfide (pps), natural color, 94v-0 contact : phosphor bronze, tin plating frame : phosphor bronze, tin plating 1.0(spacing) 5.2 (2.0) 1.7 0.3 2.4 2.4 d 1.0 b c a 1.5 3.4 0.5 2.4 3.0 0.25 2.0 2.6 a 0.05 1.0 0.05 (d 0.6) + 0.1 0 0.5 + 0.1 0 4.0min. silver ink/carbon paste : 10 m min. r0.4 (a 2) 0.1 a 0.05 1.0 0.05 0.7 0.08 1.0 0.15 lower contact type cfp25 -01 f no. of pins 1.0(spacing) 5.2 (2.0) 1.7 0.3 2.4 d 1.0 b c a 1.5 3.4 2.4 hold down packing style 01 with embossed taping 02 without embossed taping 11 with vinyl bag 12 without vinyl bag fpc connector fpc / ffc connectors
|
